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              Multichip Packages

              Get the critical features and functions for your design—including high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges—from our broad portfolio of industry-standard multichip packages (MCPs).

              View Part Catalogs
              Product Family
              Advanced Solutions
              DRAM
              DRAM Modules
              Graphics Memory
              Managed NAND
              Memory Cards
              Multichip Packages
              NAND Flash
              NOR Flash
              Solid State Drives
              Product Technology
              1100
              1300
              2200
              3D NAND Flash
              5100
              5200
              5210
              5300
              7300
              9200
              9300
              Authenta
              Authenta
              Authenta
              Authenta
              Client SSD
              DDR SDRAM
              DDR2 SDRAM
              DDR3 SDRAM
              DDR4 SDRAM
              e.MMC
              e.MMC for Automotive
              e.MMC-Based MCP
              Embedded USB
              Enterprise MLC
              Enterprise SSD
              FortisFlash
              GDDR5
              GDDR5X
              GDDR6
              Industrial microSD Cards
              Industrial SSD
              Legacy NOR Flash
              LPDRAM
              LRDIMM
              Mini-DIMM
              MLC NAND Flash
              MT25Q
              NAND-Based MCP
              NOR Flash for Automotive
              NOR-Based MCP
              NVDIMM
              NVMe SSD
              Parallel NOR Flash
              RDIMM
              RLDRAM
              SATA SSDs
              SDRAM
              Secure NOR Flash
              Serial NAND Flash
              Serial NOR Flash
              SLC NAND Flash
              SODIMM
              Solid State Drives
              SORDIMM
              TLC NAND Flash
              Twin-Quad NOR Flash
              UDIMM
              Universal Flash Storage
              VLP Mini-DIMM
              VLP RDIMM
              VLP UDIMM
              Wafer Level CSP and KGD NOR Flash
              Xccela Flash
              View Part Catalog

              By Family

              e.MMC-Based MCP
              Quick look
              Benefits
              • Embedded managed NAND and High Performance LPDRAM in a single package
              • Simplified software solutions for complex high density NAND applications
              • Technology
                e.MMC, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
              • Densities
                e.MMC: 4GB–32GB; LPDRAM: 4Gb–48Gb
              • Package
                WFBGA, VFBGA, TFBGA, POP
              UFS-Based MCP (uMCP)
              Quick look
              Benefits
              • Embedded managed NAND and high-performance LPDRAM in a single package.
              • Enables high-density, low-power storage in a small footprint.
              • Technology
                LPDDR4 SDRAM, LPDDR4X SDRAM, UFS 3D NAND
              • Densities
                UFS: 32GB; LPDRAM: 24Gb (3GB)
              • Package
                WFBGA
              NAND-Based MCP
              Quick look
              Benefits
              • Offers high densities for data-intensive applications
              • Provides high speeds, with x8, x16 and x32 bus widths
              • Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles
              • Technology
                LPDDR SDRAM, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
              • Densities
                NAND: 1Gb - 8Gb
              • Package
                WFBGA, VFBGA, TFBGA, POP
              NOR-Based MCP
              Quick look
              Benefits
              • Simplifies design while speeding performance for low-density applications
              • Reduces active ball count by more than 50% thanks to shared-bus and A/D MUX options
              • Speeds boot-up and extends battery life with execute-in-place (XIP) functionality
              • Supports low-voltage applications (1.8V)
              • NOR Densities
                32Mb - 512Mb
              • Voltage
                1.8V
              • Package
                TFBGA, VFBGA
              +
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